The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Nov. 19, 2009
Yoichiro Kawamura, Gifu, JP;
Shigeki Sawa, Gifu, JP;
Katsuhiko Tanno, Gifu, JP;
Hironori Tanaka, Gifu, JP;
Naoaki Fujii, Gifu, JP;
Yoichiro Kawamura, Gifu, JP;
Shigeki Sawa, Gifu, JP;
Katsuhiko Tanno, Gifu, JP;
Hironori Tanaka, Gifu, JP;
Naoaki Fujii, Gifu, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A printed wiring board including a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad. In the printed wiring board, since the at least one conductor pad is aligned at a pitch of about 200 μm or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is about 1.05 to about 1.7, connection reliability and insulation reliability can be easily improved.