The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Dec. 13, 2007
David L. Edwards, Poughkeepsie, NY (US);
Sushumna Iruvanti, Wappingers Falls, NY (US);
Hilton T. Toy, Hopewell Junction, NY (US);
Wei Zou, Wappingers Falls, NY (US);
David L. Edwards, Poughkeepsie, NY (US);
Sushumna Iruvanti, Wappingers Falls, NY (US);
Hilton T. Toy, Hopewell Junction, NY (US);
Wei Zou, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.