The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2011

Filed:

Nov. 13, 2008
Applicants:

Susumu Komoriya, Ashigarakami-gun, JP;

Kyoichi Mori, Ashigarakami-gun, JP;

Noritake Shizawa, Ashigarakami-gun, JP;

Takanori Yamasaki, Chiyoda-ku, JP;

Tetsuhiro Hatogai, Chiyoda-ku, JP;

Koji Tsushima, Ashigarakami-gun, JP;

Inventors:

Susumu Komoriya, Ashigarakami-gun, JP;

Kyoichi Mori, Ashigarakami-gun, JP;

Noritake Shizawa, Ashigarakami-gun, JP;

Takanori Yamasaki, Chiyoda-ku, JP;

Tetsuhiro Hatogai, Chiyoda-ku, JP;

Koji Tsushima, Ashigarakami-gun, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 59/00 (2006.01); B29B 13/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A resin stamper is provided that is intended for use in an optical transfer-based nanostructure transfer apparatus and which is capable of automatic transport and alignment. The resin stamper includes a support member made of a light transmitting material and having mechanical strength, an intermediate layer also made of a light transmitting material, and a patterned resin layer which is also made of a light transmitting material. The support member is larger in size than the intermediate layer and the patterned resin layer. The intermediate layer is more flexible than the patterned resin layer. Also, the patterned resin layer has a pattern of high and low areas formed in a surface thereof that is the obverse of the pattern of high and low areas in a mold.


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