The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2011
Filed:
Feb. 20, 2004
Satoshi Takei, Toyama, JP;
Kazuhisa Ishii, Chiyoda-ku, JP;
Takahiro Kishioka, Toyama, JP;
Yasushi Sakaida, Toyama, JP;
Satoshi Takei, Toyama, JP;
Kazuhisa Ishii, Chiyoda-ku, JP;
Takahiro Kishioka, Toyama, JP;
Yasushi Sakaida, Toyama, JP;
Nissan Chemical Industries, Ltd., Tokyo, JP;
Abstract
There is provided a gap fill material forming composition for lithography that is used in dual damascene process and is excellent in flattening property and fill property. Concretely, it is a gap fill material forming composition characterized in that the composition is used in manufacture of semiconductor device by a method comprising coating a photoresist on a semiconductor substrate having a hole with aspect ratio shown in height/diameter of 1 or more, and transferring an image to the semiconductor substrate by use of lithography process, and that comprises a polymer, a crosslinking agent and a solvent.