The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2011
Filed:
May. 06, 2008
Thomas M. Cipolla, Katonah, NY (US);
Shurong Tian, Mount Kisco, NY (US);
Evan George Colgan, Chestnut Ridge, NY (US);
Paul W. Coteus, Yorktown Heights, NY (US);
Shawn Anthony Hall, Pleasantville, NY (US);
Thomas M. Cipolla, Katonah, NY (US);
Shurong Tian, Mount Kisco, NY (US);
Evan George Colgan, Chestnut Ridge, NY (US);
Paul W. Coteus, Yorktown Heights, NY (US);
Shawn Anthony Hall, Pleasantville, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A cooling or heat transfer apparatus and method is disclosed for cooling an electronic device. The apparatus includes a heat producing electronic device which may include an electronic circuit card with many heat sources. A heat transfer device is connected to the heat producing electronic device which is thermally communicating with the heat producing device for transferring heat from the heat producing device to the heat transfer device. A heat conduit is connected to the heat transfer device and thermally communicating with the heat transfer device for transferring heat to the heat conduit from the heat transfer device. A cooling housing is connected to the heat conduit and the cooling housing thermally communicating with the heat conduit for transferring heat to the cooling housing from the heat conduit. The apparatus enables the replacement of circuit cards in the field because it eliminates the need to apply thermal-interface materials.