The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2011
Filed:
Feb. 26, 2010
Yoichiro Kawamura, Gifu, JP;
Shigeki Sawa, Gifu, JP;
Katsuhiko Tanno, Gifu, JP;
Hironori Tanaka, Gifu, JP;
Naoaki Fujii, Gifu, JP;
Yoichiro Kawamura, Gifu, JP;
Shigeki Sawa, Gifu, JP;
Katsuhiko Tanno, Gifu, JP;
Hironori Tanaka, Gifu, JP;
Naoaki Fujii, Gifu, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A printed wiring board includes a wiring substrate provided with at least one conductor circuit, a solder resist layer formed on the surface of the wiring substrate, covering the at least one conductor circuit, conductor pads formed on a part of the at least one conductor circuit exposed from respective openings provided in the solder resist layer for mounting electronic parts, and solder bumps formed on the respective conductor pads. Connection reliability and insulation reliability are easily improved by making the ratio (H/D) of a height H from solder resist layer surface the solder bump to an opening diameter of the opening about 0.55 to about 1.0 even in narrow pitch structure under the pitch of the opening provided in the solder resist layer of about 200 μm or less.