The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2011
Filed:
Mar. 12, 2009
Jin LI, Meridian, ID (US);
Tongbi Jiang, Boise, ID (US);
Jin Li, Meridian, ID (US);
Tongbi Jiang, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A method for fabricating semiconductor components includes the steps of: providing a semiconductor substrate having a circuit side, a back side and conductive vias; removing portions of the substrate from the back side to expose terminal portions of the conductive vias; depositing a polymer layer on the back side encapsulating the terminal portions; and then planarizing the polymer layer and ends of the terminal portions to form self aligned conductors embedded in the polymer layer. Additional back side elements, such as terminal contacts and back side redistribution conductors, can also be formed in electrical contact with the conductive vias. A semiconductor component includes the semiconductor substrate, the conductive vias, and the back side conductors embedded in the polymer layer. A stacked semiconductor component includes a plurality of components having aligned conductive vias in electrical communication with one another.