The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2011

Filed:

May. 11, 2009
Applicants:

Yonglai Tian, Fairfax, VA (US);

Rao V. Mulpuri, Fairfax Station, VA (US);

Siddharth G. Sundaresan, Vienna, VA (US);

Albert V. Davydov, North Potomac, MD (US);

Inventors:

Yonglai Tian, Fairfax, VA (US);

Rao V. Mulpuri, Fairfax Station, VA (US);

Siddharth G. Sundaresan, Vienna, VA (US);

Albert V. Davydov, North Potomac, MD (US);

Assignees:

George Mason Intellectual Properties, Inc., Fairfax, VA (US);

NIST, Washington, DC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); C30B 23/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention grows nanostructures using a microwave heating-based sublimation-sandwich SiC polytype growth method comprising: creating a sandwich cell by placing a source wafer parallel to a substrate wafer, leaving a small gap between the source wafer and the substrate wafer; placing a microwave heating head around the sandwich cell to selectively heat the source wafer to a source wafer temperature and the substrate wafer to a substrate wafer temperature; creating a temperature gradient between the source wafer temperature and the substrate wafer temperature; sublimating Si- and C-containing species from the source wafer, producing Si- and C-containing vapor species; converting the Si- and C-containing vapor species into liquid metallic alloy nanodroplets by allowing the metalized substrate wafer to absorb the Si- and C-containing vapor species; and growing nanostructures on the substrate wafer once the alloy droplets reach a saturation point for SiC. The substrate wafer may be coated with a thin metallic film, metal nanoparticles, and/or a catalyst.


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