The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2011
Filed:
Jul. 21, 2010
Masao Shinozaki, Higashimurayama, JP;
Kenji Nishimoto, Saitama, JP;
Takashi Akioka, Kokubunji, JP;
Yutaka Kohara, Annaka, JP;
Sanae Asari, Kofu, JP;
Shusaku Miyata, Kokubunji, JP;
Shinji Nakazato, Maebashi, JP;
Masao Shinozaki, Higashimurayama, JP;
Kenji Nishimoto, Saitama, JP;
Takashi Akioka, Kokubunji, JP;
Yutaka Kohara, Annaka, JP;
Sanae Asari, Kofu, JP;
Shusaku Miyata, Kokubunji, JP;
Shinji Nakazato, Maebashi, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Hitachi ULSI Systems Co., Ltd., Tokyo, JP;
Abstract
Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.