The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2011
Filed:
Sep. 30, 2008
Chih-yi Huang, Kaohsiung, TW;
Hung-hsiang Cheng, Kaohsiung, TW;
Chih-Yi Huang, Kaohsiung, TW;
Hung-Hsiang Cheng, Kaohsiung, TW;
Advanced Semiconductor Engineering Inc., Kaohsiung, TW;
Abstract
A semiconductor package and a method for making the same, whereby the semiconductor package includes a substrate, a first passivation layer, a first metal layer, a second passivation layer, and second and third metal layers. The substrate has a surface having at least first and second pads. The first passivation layer covers the surface of the substrate and exposes the first pad and the second pad. The first metal layer is formed on the first passivation layer and is electrically connected to the second pad. The second passivation layer is formed on the first metal layer and exposes the first pad and part of the first metal layer. The second metal layer is formed on the second passivation layer and is electrically connected to the first pad. The third metal layer is formed on the second passivation layer and is electrically connected to the first metal layer.