The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2011
Filed:
Dec. 31, 2002
John Donohue, Hillsboro, OR (US);
Hongyu Yue, Austin, TX (US);
John Donohue, Hillsboro, OR (US);
Hongyu Yue, Austin, TX (US);
Tokyo Electron Limited, Tokyo, JP;
Abstract
A method for material processing utilizing a material processing system to perform a process. The method performs a process (), measures a scan of data (), and transforms the data scan () into a signature () including at least one spatial component. The scan of data () can include a process performance parameter such as an etch rate, an etch selectivity, a deposition rate, a film property, etc. The signature () can be stored (), and compared with either a previously acquired signature or with an ideal signature (). If at least one spatial component substantially deviates from the reference spatial component, then a process fault has potentially occurred. If the cumulative deviation of all spatial components or a select group of components substantially deviates from a reference set of spatial components, then a process fault has potentially occurred.