The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2011
Filed:
Jul. 09, 2008
Yi-shao Lai, Taipei, TW;
Tsung-yueh Tsai, Kaohsiung, TW;
Hsiao-chuan Chang, Kaohsiung, TW;
Tsan-hsien Chen, Kaohsiung, TW;
Yi-Shao Lai, Taipei, TW;
Tsung-Yueh Tsai, Kaohsiung, TW;
Hsiao-Chuan Chang, Kaohsiung, TW;
Tsan-Hsien Chen, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A tenon-and-mortise packaging structure including a carrier and a chip is provided. The carrier has a top surface and a lower surface opposite to the top surface. The top surface forms at least one tenon projection, and the lower surface forms a mortise slot corresponding to the tenon projection in shape, size, and position, so that two carriers can be stacked on and jointed to each other by coupling the tenon projection to the corresponding mortise slot. The tenon projection and the mortise slot have conduction portions, respectively. When the tenon projection and the mortise slot are engaged with each other, the conduction portions are electrically connected with each other. At least one chip is embedded in the carrier. The chip has an active surface and a back side respectively and electrically connected with the top and the lower surfaces of the carrier.