The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2011
Filed:
Jan. 12, 2006
Krishna G. Sachdev, Hopewell Junction, NY (US);
Harbans Singh Sachdev, Legal Representative, Hopewell Junction, NY (US);
Mark S. Chace, Beacon, NY (US);
Normand Cote, Canton de Granby, CA;
David L. Gardell, Fairfax, VT (US);
Jeffrey D. Gelorme, Burlington, CT (US);
Sushumna Iruvanti, Wappingers Falls, NY (US);
G. John Lawson, Barre, VT (US);
Tuknekah M. Noble, Hanover, NH (US);
Krishna G. Sachdev, Hopewell Junction, NY (US);
Harbans Singh Sachdev, legal representative, Hopewell Junction, NY (US);
Mark S. Chace, Beacon, NY (US);
Normand Cote, Canton de Granby, CA;
David L. Gardell, Fairfax, VT (US);
Jeffrey D. Gelorme, Burlington, CT (US);
Sushumna Iruvanti, Wappingers Falls, NY (US);
G. John Lawson, Barre, VT (US);
Tuknekah M. Noble, Hanover, NH (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Liquid compositions containing a specific hindered phenol or a hindered phenol in combination with an aromatic phosphite are provided which are used as a thermal interface between a heatsink and a chip during a test procedure for electronic components which compositions enhance the thermal conductivity between the heatsink and the chip, are easily removed from the heatsink and the chip after the test procedure without any deleterious residue and which allow the use of high temperatures for extended periods during the test procedure without any significant degradation of the composition. A method for using the compositions in electronic component test procedures such as burn-in procedures is also provided.