The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2011
Filed:
Mar. 06, 2008
Thomas Ponnuswamy, Sherwood, OR (US);
John Sukamto, Lake Oswego, OR (US);
Jonathan Reid, Sherwood, OR (US);
Steve Mayer, Lake Oswego, OR (US);
Thomas Ponnuswamy, Sherwood, OR (US);
John Sukamto, Lake Oswego, OR (US);
Jonathan Reid, Sherwood, OR (US);
Steve Mayer, Lake Oswego, OR (US);
Novellus Systems, Inc., San Jose, CA (US);
Abstract
A two-step semiconductor electroplating process deposits copper onto wafers coated with a semi-noble metal in manner that is uniform across the wafer and free of voids after a post electrofill anneal. A seed-layer plating bath nucleates copper uniformly and conformably at a high density in a very thin film using a unique pulsed waveform. The wafer is then annealed before a second bath fills the features. The seed-layer anneal improves adhesion and stability of the semi-noble to copper interface, and the resulting copper interconnect stays void-free after a post electrofill anneal.