The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2011
Filed:
Oct. 01, 2007
Robert J. Allen, Jericho, VT (US);
John M. Cohn, Richmond, VT (US);
Scott W. Gould, South Burlington, VT (US);
Peter A. Habitz, Hinesburg, VT (US);
Juergen Koehl, Weil im Schoenbuch, DE;
Gustavo E. Tellez, Essex Junction, VT (US);
Ivan L. Wemple, Shelburne, VT (US);
Paul S. Zuchowski, Jericho, VT (US);
Robert J. Allen, Jericho, VT (US);
John M. Cohn, Richmond, VT (US);
Scott W. Gould, South Burlington, VT (US);
Peter A. Habitz, Hinesburg, VT (US);
Juergen Koehl, Weil im Schoenbuch, DE;
Gustavo E. Tellez, Essex Junction, VT (US);
Ivan L. Wemple, Shelburne, VT (US);
Paul S. Zuchowski, Jericho, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
In a first aspect, an inventive apparatus for imaging a chip on a wafer includes a combined diamond chip image and kerf image having a plurality of sloped sides. The combined diamond chip image and kerf image includes a diamond chip image comprising a plurality of chip image rows that are parallel to at least one diagonal of the diamond chip image, and includes a kerf image adjacent to the diamond chip image. The kerf image comprises at least one kerf image row that is parallel to the at least one diagonal of the diamond chip image. The apparatus further includes a blocking material extending from the combined diamond chip image and kerf image to at least a periphery of an exposure field of a stepper. In a second aspect the imaging apparatus comprises an n-sided polygon-shaped combined chip image and kerf image. Also provided are inventive methods of manufacturing chips, and wafers manufactured in accordance with the inventive methods.