The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2011
Filed:
Jun. 25, 2008
Applicants:
Kyunghoon Lee, Icheon, KR;
OH Han Kim, Icheon, KR;
Inventors:
KyungHoon Lee, Icheon, KR;
Oh Han Kim, Icheon, KR;
Assignee:
STATS Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A stacked integrated circuit package system includes: forming a recessed integrated circuit package system having a first encapsulation over a first integrated circuit and an interior cavity in the first encapsulation; forming a mountable integrated circuit package system having a second integrated circuit over a carrier; and mounting the recessed integrated circuit package system over the mountable integrated circuit package system with the second integrated circuit within the interior cavity and the first integrated circuit coupled with the carrier.