The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Mar. 10, 2009
Jens Pohl, Bernhardswald, DE;
Edward Fuergut, Dasing, DE;
Markus Brunnbauer, Lappersdorf, DE;
Thorsten Meyer, Regensburg, DE;
Peter Strobel, Regensburg, DE;
Daniel Porwol, Straubing, DE;
Ulrich Wachter, Riedenburg, DE;
Jens Pohl, Bernhardswald, DE;
Edward Fuergut, Dasing, DE;
Markus Brunnbauer, Lappersdorf, DE;
Thorsten Meyer, Regensburg, DE;
Peter Strobel, Regensburg, DE;
Daniel Porwol, Straubing, DE;
Ulrich Wachter, Riedenburg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method of manufacturing semiconductor device comprises placing multiple chips onto a carrier. An encapsulation material is applied to the multiple chips and the carrier for forming an encapsulation workpiece. The encapsulation workpiece having a first main face facing the carrier and a second main face opposite to the first main face. Further, marking elements are applied to the encapsulation workpiece relative to the multiple chips, the marking elements being detectable on the first main face and on the second main face.