The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2011
Filed:
May. 17, 2005
Michael Bauer, Nittendorf, DE;
Thomas Bemmerl, Schwandorf, DE;
Edward Fuergut, Dasing, DE;
Simon Jerebic, Regensburg, DE;
Herman Vilsmeier, Karlsfeld, DE;
Michael Bauer, Nittendorf, DE;
Thomas Bemmerl, Schwandorf, DE;
Edward Fuergut, Dasing, DE;
Simon Jerebic, Regensburg, DE;
Herman Vilsmeier, Karlsfeld, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A support with solder ball elements for loading substrates with ball contacts is disclosed. One embodiment provides a system for loading substrates with ball contacts and a method for loading substrates with ball contacts. The support has a layer of adhesive applied on one side, the layer of adhesive losing its adhesive force to the greatest extent when irradiated. The support has solder ball elements, which are arranged closely packed in rows and columns on the layer of adhesive in a prescribed pitch for a semiconductor chip or a semiconductor component.