The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2011
Filed:
Dec. 13, 2007
Takashi Noma, Ota, JP;
Katsuhiko Kitagawa, Ota, JP;
Hisao Otsuka, Gunma, JP;
Akira Suzuki, Ota, JP;
Yoshinori Seki, Gunma, JP;
Yukihiro Takao, Gunma, JP;
Keiichi Yamaguchi, Gifu, JP;
Motoaki Wakui, Kumagaya, JP;
Masanori Iida, Gunma, JP;
Takashi Noma, Ota, JP;
Katsuhiko Kitagawa, Ota, JP;
Hisao Otsuka, Gunma, JP;
Akira Suzuki, Ota, JP;
Yoshinori Seki, Gunma, JP;
Yukihiro Takao, Gunma, JP;
Keiichi Yamaguchi, Gifu, JP;
Motoaki Wakui, Kumagaya, JP;
Masanori Iida, Gunma, JP;
Sanyo Electric Co., Ltd., Moriguchi-shi, JP;
Kanto Sanyo Semiconductor Co., Ltd., Gunma, JP;
Abstract
A manufacturing method of a semiconductor device formed in a chip size package is improved to enhance a yield and reliability. A window to expose first wirings is formed only in a region of a semiconductor substrate where the first wirings exist. As a result, area of the semiconductor substrate bonded to a supporting body through an insulation film and a resin is increased to prevent cracks in the supporting body and separation of the semiconductor substrate from the supporting body. A slit is formed along a dicing line after forming the window, the slit is covered with a protection film and then the semiconductor substrate is diced into individual semiconductor dice. Thus, separation on a cut surface or at an edge of the semiconductor dice, which otherwise would be caused by contact of the blade in the dicing can be prevented.