The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2011

Filed:

Dec. 23, 2009
Applicants:

Wagdi W. Abadeer, Jericho, VT (US);

James W. Adkisson, Jericho, VT (US);

Jeffrey S. Brown, Middlesex, VT (US);

Kiran V. Chatty, Williston, VT (US);

Robert J. Gauthier, Jr., Hinesburg, VT (US);

Michael J. Hauser, Bolton, VT (US);

Jed H. Rankin, South Burlington, VT (US);

William R. Tonti, Essex Junction, VT (US);

Inventors:

Wagdi W. Abadeer, Jericho, VT (US);

James W. Adkisson, Jericho, VT (US);

Jeffrey S. Brown, Middlesex, VT (US);

Kiran V. Chatty, Williston, VT (US);

Robert J. Gauthier, Jr., Hinesburg, VT (US);

Michael J. Hauser, Bolton, VT (US);

Jed H. Rankin, South Burlington, VT (US);

William R. Tonti, Essex Junction, VT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 40/14 (2006.01); H03K 17/78 (2006.01); H02H 9/00 (2006.01); G01R 27/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a method of executing an electrical function, such as a fusing operation, by activation through a chip embedded photodiode through spectrally selected external light activation, and corresponding structure and circuit. The present invention is based on having incident light with specific intensity/wave length characteristics, in conjunction with additional circuit elements to an integrated circuit, perform the implementation of repairs, i.e., replacing failing circuit elements with redundant ones for yield and/or reliability. Also to perform disconnection of ESD protection device from input pad one the packaged chip is placed in system. No additional pins on the package are necessary.


Find Patent Forward Citations

Loading…