The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2011

Filed:

Jan. 19, 2007
Applicants:

Cyrus E. Tabery, Santa Clara, CA (US);

Srikanteswara Dakshina-murthy, Wappingers Falls, NY (US);

Chih-yuh Yang, San Jose, CA (US);

Bin Yu, Cupertino, CA (US);

Inventors:

Cyrus E. Tabery, Santa Clara, CA (US);

Srikanteswara Dakshina-Murthy, Wappingers Falls, NY (US);

Chih-Yuh Yang, San Jose, CA (US);

Bin Yu, Cupertino, CA (US);

Assignee:

GlobalFoundries Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods are provided for forming contacts for a semiconductor device. The methods may include depositing various materials, such as polysilicon, nitride, oxide, and/or carbon materials, over the semiconductor device. The methods may also include forming a contact hole and filling the contact hole to form the contact for the semiconductor device.


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