The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7896973 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 01, 2011

Filed:

Feb. 13, 2004
Applicants:

Naoki Shindo, Nirasaki, JP;

Tadashi Iino, Nirasaki, JP;

Inventors:

Naoki Shindo, Nirasaki, JP;

Tadashi Iino, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/00 (2006.01); B08B 7/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

This substrate processing apparatus supplies wafers W accommodated in a closed processing containerwith ozone gas and steam for processing the wafers W. The apparatus includes an ozone-gas generatorfor supplying the ozone gas into the processing container, a steam generatorfor supplying the steam into the processing containerand a steam nozzlearranged in the processing containerand connected to the steam generator. The steam nozzleis equipped with a nozzle bodyhaving a plurality of steam ejecting orificesformed at appropriate intervals and a heaterfor preventing dewdrops of the steam from being produced in the nozzle body. Consequently, it is possible to prevent the formation of dewdrops of solvent steam, which may produce origins of particles in the closed processing container, unevenness in cleaning (etching), etc., and also possible to improve the processing efficiency.


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Shindo, Naoki. (2011). Substrate processing apparatus and substrate processing method (U.S. Patent No. 7896973). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7896973

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