The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2011
Filed:
Nov. 22, 2006
Shinjiro Watanabe, Nirasaki, JP;
Shinjiro Watanabe, Nirasaki, JP;
Tokyo Electron Limited, Tokyo, JP;
Abstract
The present invention is a bonding apparatus which bonds a first object to be bonded and a second object to be bonded by bringing a bonding member into contact with an upper surface of the second object to be bonded placed on an upper surface of the first object to be bonded and ultrasonically vibrating the second object to be bonded by the bonding member, and the bonding member includes: a contact portion brought into contact with the second object to be bonded; and a holding portion holding the second object to bonded. With this structure, it is possible to prevent the object to bonded from sliding sideways to thereby properly bond the objects to be bonded to each other, even with a low pressing force.