The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2011
Filed:
Sep. 05, 2007
Chao-yuan Su, Hsin-Chu, TW;
Chao-Yuan Su, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A wafer-level chip-scale packaging feature for a semiconductor device is disclosed which has a substrate, a plurality of nail-shaped conducting posts extending from a surface of the substrate, and a plurality of solder balls, where each of the solder balls is connected to one of the nail-shaped conducting posts. When a different-sized solder ball is desired for use, the device can be re-processed by only removing and replacing the cross-members of the nail-shaped conducting posts, which cuts down on the re-processing expense.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile