The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2011
Filed:
Jul. 01, 2009
Masaru Nakamura, Ota-ku, JP;
Masatoshi Wakahara, Ota-ku, JP;
Motoko Nakayama, Ota-ku, JP;
Yuki Nakamura, Ota-Ku, JP;
Masaru Nakamura, Ota-ku, JP;
Masatoshi Wakahara, Ota-ku, JP;
Motoko Nakayama, Ota-ku, JP;
Yuki Nakamura, Ota-Ku, JP;
Disco Corporation, Tokyo, JP;
Abstract
In a semiconductor device manufacturing method in which a wafer formed with devices in a plurality of areas sectioned by a plurality of streets formed in a lattice-like pattern on the front surface is divided into the individual devices along the streets, when the wafer is divided into the individual devices by exposing cut grooves formed along the streets by a dicing before grinding process, a rigid plate is applied to the front surface of the wafer and an adhesive film is attached to the rear surface of the wafer. Thereafter, a separation groove forming step is performed in which a laser beam is directed to the adhesive film along the cut grooves from the dicing tape side applied with the wafer attached with the adhesive film to form separation grooves in the adhesive film along the cut grooves.