The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2011
Filed:
Jul. 16, 2007
Applicants:
Yasushi Inagaki, Ibi-gun, JP;
Motoo Asai, Ibi-gun, JP;
Dongdong Wang, Ibi-gun, JP;
Hideo Yabashi, Ibi-gun, JP;
Seiji Shirai, Ibi-gun, JP;
Inventors:
Yasushi Inagaki, Ibi-gun, JP;
Motoo Asai, Ibi-gun, JP;
Dongdong Wang, Ibi-gun, JP;
Hideo Yabashi, Ibi-gun, JP;
Seiji Shirai, Ibi-gun, JP;
Assignee:
IBIDEN Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
Abstract
A chip capacitor is provided in a core substrate of a printed circuit board. This makes it possible to shorten a distance between an IC chip and the chip capacitor and to reduce loop inductance. Since the core substrate is constituted by provided a first resin substrate, a second resin substrate and a third resin substrate in a multilayer manner, the core substrate can obtain sufficient strength.