The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2011

Filed:

Dec. 18, 2007
Applicants:

Xiang HU, Singapore, SG;

Hai Cong, Singapore, SG;

Pradeep Yelehanka, Singapore, SG;

Mei Sheng Zhou, Singapore, SG;

Inventors:

Xiang Hu, Singapore, SG;

Hai Cong, Singapore, SG;

Pradeep Yelehanka, Singapore, SG;

Mei Sheng Zhou, Singapore, SG;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); G01R 31/00 (2006.01); B44C 1/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for etching a thin film and fabricating a semiconductor device includes etching the thin film on a substrate, while monitoring the removal of an endpoint detection layer remotely located from the substrate, such that precise control of the thin film etching is provided by monitoring the removal of the endpoint detection layer. The endpoint detection layer is formed on a surface of an etching apparatus that is exposed to the same etching conditions as the thin film to be etched. The etching of the thin film is stopped when a predetermined amount of the endpoint detection layer has removed from the surface of the etching apparatus.


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