The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2011
Filed:
Feb. 27, 2008
Imad Yousif, San Jose, CA (US);
Ying Rui, Santa Clara, CA (US);
Nancy Fung, Livermore, CA (US);
Martin Jeffrey Salinas, San Jose, CA (US);
Ajit Balakrishna, Sunnyvale, CA (US);
Anchel Sheyner, San Francisco, CA (US);
Shahid Rauf, Pleasanton, CA (US);
Walter R. Merry, Sunnyvale, CA (US);
Imad Yousif, San Jose, CA (US);
Ying Rui, Santa Clara, CA (US);
Nancy Fung, Livermore, CA (US);
Martin Jeffrey Salinas, San Jose, CA (US);
Ajit Balakrishna, Sunnyvale, CA (US);
Anchel Sheyner, San Francisco, CA (US);
Shahid Rauf, Pleasanton, CA (US);
Walter R. Merry, Sunnyvale, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Embodiments of the present invention provide apparatus and method for front side protection while processing side and backside of a substrate. One embodiment of the present invention provides a showerhead configured to provide a purge gas to a front side of a substrate during a backside etch processing. The showerhead comprises a body configured to be disposed over the front side of the substrate. The body has a process surface configured to face the front side of the substrate. The process surface has an outer circular region, a central region, a middle region between the outer central region and the central region. The first plurality of holes are distributed in the outer circular region and configured to direct the purge gas towards an edge area of the front side of the substrate. No gas delivery hole is distributed within a substantial portion of the middle region.