The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7878883 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 01, 2011

Filed:

Jan. 10, 2007
Applicants:

Puneet Gupta, St. Peters, MO (US);

Milind S. Kulkarni, St. Louis, MO (US);

Carlo Zavattari, Novara, IT;

Roland R. Vandamme, Wentzville, MO (US);

Inventors:

Puneet Gupta, St. Peters, MO (US);

Milind S. Kulkarni, St. Louis, MO (US);

Carlo Zavattari, Novara, IT;

Roland R. Vandamme, Wentzville, MO (US);

Assignee:

MEMC Electronics Materials, Inc., St. Peters, MO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/00 (2006.01); B28D 1/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system and method for slicing an ingot into wafers using the wire saw process. A slurry collection system collects and supplies slurry to a slurry handling system for controlling temperatures and/or flow rates of the slurry thereby providing slurry output at a controlled temperature and/or a controlled flow rate to slicing system for cutting the ingot, which may be preheated.


Find Patent Forward Citations

Gupta, Puneet. (2011). Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control (U.S. Patent No. 7878883). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7878883

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