The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2010
Filed:
Apr. 25, 2007
Miki Aruga, Nirasaki, JP;
Kazuyoshi Yamazaki, Richardson, TX (US);
Shintaro Aoyama, Nirasaki, JP;
Kouji Shimomura, Nirasaki, JP;
Miki Aruga, Nirasaki, JP;
Kazuyoshi Yamazaki, Richardson, TX (US);
Shintaro Aoyama, Nirasaki, JP;
Kouji Shimomura, Nirasaki, JP;
Tokyo Electron Limited, Tokyo, JP;
Abstract
A disclosed substrate processing method in a single wafer substrate processing device including a first process position for introducing nitrogen atoms to a high-dielectric film and a second process position for performing heat treatment on the high-dielectric film includes: successively conveying plural substrates to be processed to the first process position and the second process position one by one; and successively performing the introduction of nitrogen atoms and the heat treatment on the high-dielectric film on the substrates to be processed, wherein the treatment on the substrate to be processed is started within 30 seconds at the second process position after the process at the first position.