The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2010
Filed:
Jan. 30, 2007
Katsuhiro Yamashita, Shizuoka-ken, JP;
Kenji Takenouchi, Kanagawa, JP;
Tomoo Kato, Shizuoka-ken, JP;
Yoshinori Nishiwaki, Shizuoka-ken, JP;
Mihoko Ishima, Shizuoka-ken, JP;
Katsuhiro Yamashita, Shizuoka-ken, JP;
Kenji Takenouchi, Kanagawa, JP;
Tomoo Kato, Shizuoka-ken, JP;
Yoshinori Nishiwaki, Shizuoka-ken, JP;
Mihoko Ishima, Shizuoka-ken, JP;
Fujifilm Corporation, Tokyo, JP;
Abstract
The invention provides a metal polishing liquid comprising an oxidizing agent and colloidal silica in which a part of a surface of the colloidal silica is covered with aluminum atoms, and a Chemical Mechanical Polishing method using the same. An amino acid, a compound having an isothiazoline-3-one skeleton, an organic acid, a passivated film forming agent, a cationic surfactant, a nonionic surfactant, and a water-soluble polymer may be contained. A metal polishing liquid which is used in Chemical Mechanical Polishing in manufacturing of a semiconductor device, attains low dishing of a subject to be polished, and can perform polishing excellent in in-plane uniformity of a surface to be polished.