The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7855137 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 21, 2010

Filed:

Aug. 12, 2008
Applicants:

Mukta G. Farooq, Hopewell Junction, NY (US);

Waldemar Walter Kocon, Newburgh, NY (US);

Kevin Shawn Petrarca, Newburgh, NY (US);

Richard Paul Volant, New Fairfield, CT (US);

Inventors:

Mukta G. Farooq, Hopewell Junction, NY (US);

Waldemar Walter Kocon, Newburgh, NY (US);

Kevin Shawn Petrarca, Newburgh, NY (US);

Richard Paul Volant, New Fairfield, CT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of forming conductive pillars on a semiconductor wafer in which the conductive pillars are plated with a protecting coating of Ni, Co, Cr, Rh, NiP, NiB , CoWP, or CoP. Only the side of the conductive pillars are plated. The ends of the conductive pillars are free of the protective plating so that the conductive pillars can be readily joined to the pads of a packaging substrate. Also disclosed is a sidewall-protected conductive pillar having a protective coating of Ni, Co, Cr, Rh, NiP, NiB , CoWP, or CoP thereon.


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