The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7851384 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 14, 2010

Filed:

May. 21, 2007
Applicants:

Yijun Liu, Sunnyvale, CA (US);

Huiwen Xu, Sunnyvale, CA (US);

Li-qun Xia, Santa Clara, CA (US);

Chad Peterson, San Jose, CA (US);

Hichem M'saad, Santa Clara, CA (US);

Inventors:

Yijun Liu, Sunnyvale, CA (US);

Huiwen Xu, Sunnyvale, CA (US);

Li-Qun Xia, Santa Clara, CA (US);

Chad Peterson, San Jose, CA (US);

Hichem M'Saad, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/469 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods are provided for processing a substrate comprising a bilayer barrier film thereon. In one aspect, a method comprises depositing a first barrier layer, depositing a second barrier layer on the first barrier layer, depositing a dielectric layer on the bilayer barrier film formed by the first barrier layer and the second barrier layer, and ultraviolet curing the dielectric layer. In another aspect, a method comprises depositing a first barrier layer, depositing a second barrier layer on the first barrier layer, depositing a dielectric layer on the bilayer barrier film formed by the first barrier layer and the second barrier layer, and curing the dielectric layer with an electron beam treatment.


Find Patent Forward Citations

Liu, Yijun. (2010). Method to mitigate impact of uv and e-beam exposure on semiconductor device film properties by use of a bilayer film (U.S. Patent No. 7851384). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7851384

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