The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2010
Filed:
Jul. 14, 2006
Toshio Gomyo, Nagano, JP;
Yukiharu Takeuchi, Nagano, JP;
Hidenori Takayanagi, Nagano, JP;
Takaharu Yamano, Nagano, JP;
Toshio Gomyo, Nagano, JP;
Yukiharu Takeuchi, Nagano, JP;
Hidenori Takayanagi, Nagano, JP;
Takaharu Yamano, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
In an electronic parts packaging structure of the present invention constructed by stacking a plurality of sheet-like units in a thickness direction, each of the units includes a first insulating layer, wirings formed on one surface of the first insulating layer, a semiconductor chip (electronic parts) connected to the wirings, a second insulating layer formed on an one surface side of the first insulating layer to cover the semiconductor chip, and connecting portions (terminals and contact vias) for connecting electrically the wirings and wirings of other unit, wherein arrangement of the first insulating layer, the semiconductor chip, the wirings, and the second insulating layer is symmetrical between units adjacent in a thickness direction.