The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2010
Filed:
Oct. 31, 2006
Ming-huan Yang, Taichung County, TW;
Chung-wei Wang, Sijhih, TW;
Chia-chi Wu, Sindian, TW;
Chao-kai Cheng, Hsinchu County, TW;
Tzyy-jang Tseng, Taoyuan, TW;
Chang-ming Lee, Taoyuan, TW;
Cheng-po Yu, Taoyuan, TW;
Cheng-hung Yu, Taoyuan, TW;
Ming-Huan Yang, Taichung County, TW;
Chung-Wei Wang, Sijhih, TW;
Chia-Chi Wu, Sindian, TW;
Chao-Kai Cheng, Hsinchu County, TW;
Tzyy-Jang Tseng, Taoyuan, TW;
Chang-Ming Lee, Taoyuan, TW;
Cheng-Po Yu, Taoyuan, TW;
Cheng-Hung Yu, Taoyuan, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink-jet printing that includes providing a substrate, forming a first self-assembly membrane (SAM) on at least one side of the substrate, forming a non-adhesive membrane on the first SAM, forming at least one microhole in the substrate, forming a second SAM on a surface of the microhole, providing catalyst particles on the at least one side of the substrate and on the surface of the microhole, and forming a catalyst circuit pattern on the substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile