The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2010
Filed:
Oct. 29, 2003
Hiroshi Mashima, Nagasaki, JP;
Akira Yamada, Nagasaki, JP;
Keisuke Kawamura, Nagasaki, JP;
Kenji Tagashira, Nagasaki, JP;
Yoshiaki Takeuchi, Nagasaki, JP;
Hiroshi Mashima, Nagasaki, JP;
Akira Yamada, Nagasaki, JP;
Keisuke Kawamura, Nagasaki, JP;
Kenji Tagashira, Nagasaki, JP;
Yoshiaki Takeuchi, Nagasaki, JP;
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Abstract
A method for making the characteristics of the distribution of film thickness uniform is provided, avoiding generation of phase differences among streams of high-frequency electric power by manipulating the electrical characteristics of cables through which the high-frequency electric power is transmitted. Coaxial cables (toandto) having a standard length and vacuum cables (toandto) are installed, then a film is formed on a substrate by actually supplying high-frequency electric power, and thereafter the condition of vapor deposition such as the thickness of the film is observed. Based on the observations, the full lengths of the coaxial cables which communicate with the feeding points and the electrodes which correspond with positions over the substrate which need to be adjusted are changed. The coaxial cables are installed again, and high-frequency electric power equivalent to that used in the previous operation is supplied to form a film. The distribution of the film formed on the substrate is made uniform by repeating the above operations.