The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2010
Filed:
Aug. 16, 2007
BO Jiang, Newark, DE (US);
Gregory P. Muldowney, Earleville, MD (US);
Bo Jiang, Newark, DE (US);
Gregory P. Muldowney, Earleville, MD (US);
Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US);
Abstract
The polishing pad () is useful for polishing at least one of magnetic, optical and semiconductor substrates () in the presence of a polishing medium (). The polishing pad () includes a plurality of polishing elements (). The polishing elements () are aligned in a vertical direction and having a first and a second end. A plurality of junctions () connects the first and second ends of the polishing elements () with at least three polishing elements at each of the plurality of junctions () for forming a tier. Each tier representing a thickness in the vertical direction between the first and second ends of the polishing elements (). And an interconnected lattice structure () forms from connecting sequential tiers of the plurality of junctions () that connect the polishing elements ().