The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2010
Filed:
Aug. 29, 2008
Chu-chung Lee, Round Rock, TX (US);
Min Ding, Austin, TX (US);
Kevin J. Hess, Round Rock, TX (US);
Peng Su, San Jose, CA (US);
Chu-Chung Lee, Round Rock, TX (US);
Min Ding, Austin, TX (US);
Kevin J. Hess, Round Rock, TX (US);
Peng Su, San Jose, CA (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A package device has a package substrate, a semiconductor die on the package substrate, and a molding compound on the package substrate and over the semiconductor die. The semiconductor die has a last passivation layer, an active circuit region in an internal portion of the die, an edge seal region along a periphery of the die, and a structure over the edge seal region extending above the last passivation layer, covered by the molding compound, and comprising a polymer material. The structure may extend at least five microns above the last passivation layer. The structure stops cracks in the molding compound from reaching the active circuit region. The cracks, if not stopped, can reach wire bonds in the active region and cause them to fail.