The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2010
Filed:
Jan. 22, 2009
Sushumna Iruvanti, Wappingers Falls, NY (US);
Randall G. Kemink, Poughkeepsie, NY (US);
Rajneesh Kumar, Poughkeepsie, NY (US);
Steven P. Ostrander, Poughkeepsie, NY (US);
Prabjit Singh, Poughkeepsie, NY (US);
Sushumna Iruvanti, Wappingers Falls, NY (US);
Randall G. Kemink, Poughkeepsie, NY (US);
Rajneesh Kumar, Poughkeepsie, NY (US);
Steven P. Ostrander, Poughkeepsie, NY (US);
Prabjit Singh, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a composition of non-silicone organics exhibiting thermal conductivity of approximately 5.5 W/mK or greater and a compressed bond-line thickness of approximately 100 microns or less using a compressive force of approximately 100 psi or less.