The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2010
Filed:
Oct. 07, 2005
Jer-liang Yeh, Taichung, TW;
Jing-yi Huang, Kaohsiung, TW;
Wen-ching Hsu, Sanchong, TW;
Ya-lan Ho, Judung Jen, TW;
Sung-lin Hsu, Hsinchu, TW;
Jung-tsung Wang, Hsinchu, TW;
Jer-Liang Yeh, Taichung, TW;
Jing-Yi Huang, Kaohsiung, TW;
Wen-Ching Hsu, Sanchong, TW;
Ya-Lan Ho, Judung Jen, TW;
Sung-Lin Hsu, Hsinchu, TW;
Jung-Tsung Wang, Hsinchu, TW;
Sino-American Silicon Products Inc., Hsinchu, TW;
Abstract
The invention provides a method of manufacturing a composite wafer structure. In particular, the method, according to the invention, is based on the fracture mechanics theory to actively control fracture induced during the manufacture of the composite wafer structure and to further protect from undesired edge damage. Thereby, the method, according to the invention, can enhance the yield rate of industrial mass production regarding the composite wafer structure.