The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
Jul. 18, 2008
Shigeru Mizuno, Nagano, JP;
Takashi Kurihara, Nagano, JP;
Akinori Shiraishi, Nagano, JP;
Kei Murayama, Nagano, JP;
Mitsutoshi Higashi, Nagano, JP;
Shigeru Mizuno, Nagano, JP;
Takashi Kurihara, Nagano, JP;
Akinori Shiraishi, Nagano, JP;
Kei Murayama, Nagano, JP;
Mitsutoshi Higashi, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;
Abstract
After plural semiconductor elements are stacked to form a stacked body P, side wirings are formed on the side surface of the stacked body P, thereby manufacturing a semiconductor apparatus in which the respective semiconductor elements are electrically connected to one another. In this case, as the semiconductor element, a semiconductor elementis employed in which a gold wirewith its one end connected to an electrode terminal of the semiconductor element is extended out to the side surface. A conductive pastecontaining conductive particles applied over a predetermined length of a transferring wireis transferred to the side surface of the stacked body P so that the gold wiresextended out to the side surfaces of the semiconductor elementsare connected, thereby forming the side wirings.