The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2010
Filed:
Nov. 17, 2006
Applicants:
Chih-min Wen, Hsinchu, TW;
Chen-hsiang Liao, Hsinchu County, TW;
Inventors:
Chih-Min Wen, Hsinchu, TW;
Chen-Hsiang Liao, Hsinchu County, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd, Hsin-Chu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method and apparatus for performing first and second polishings on a workpiece wherein the first and second polishings are performed using different operating parameters.
Wen, Chih-Min. (2010). Method and apparatus for chemical mechanical polishing including first and second polishing (U.S. Patent No. 7799689). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7799689
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile