logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7799674 B1

PDFFull Text
Date of Patent:
Sep. 21, 2010

Filed:

May. 29, 2008

Ruthenium alloy film for copper interconnects

Applicants:

Hiroshi Shinriki, Tama, JP;

Hiroaki Inoue, Tama, JP;

Inventors:

Hiroshi Shinriki, Tama, JP;

Hiroaki Inoue, Tama, JP;

Assignee:

ASM Japan K.K., Tokyo, JP;

Attorney:

Knobbe, Martens, Olson & Bear LLP

Primary Examiner:

Ha Tran T Nguyen

Assistant Examiner:

Valerie Brown

Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 21/44 (2006.01); H01L 21/302 (2006.01); H01L 21/461 (2006.01); H01L 29/40 (2006.01); H01L 23/52 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for forming interconnect wiring, includes: (i) covering a surface of a connection hole penetrating through interconnect dielectric layers formed on a substrate for interconnect wiring, with an underlying alloy layer selected from the group consisting of an alloy film containing ruthenium (Ru) and at least one other metal atom (M), a nitride film thereof, a carbide film thereof, and an nitride-carbide film thereof, and (ii) filling copper or a copper compound in the connection hole covered with the underlying layer.

Find Patent Forward Citations

Shinriki, Hiroshi. (2010). Ruthenium alloy film for copper interconnects (U.S. Patent No. 7799674). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7799674

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…