The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2010
Filed:
Aug. 18, 2006
Tetsuo Fukuoka, Koshi, JP;
Masami Akimoto, Koshi, JP;
Takahiro Kitano, Koshi, JP;
Yoshio Kimura, Koshi, JP;
Shinichi Hayashi, Koshi, JP;
Hikaru Ito, Minato-Ku, JP;
Tetsuo Fukuoka, Koshi, JP;
Masami Akimoto, Koshi, JP;
Takahiro Kitano, Koshi, JP;
Yoshio Kimura, Koshi, JP;
Shinichi Hayashi, Koshi, JP;
Hikaru Ito, Minato-Ku, JP;
Tokyo Electron Limited, Tokyo-To, JP;
Abstract
A heating apparatuscomprises a housing; a flat heating chamberwhich is provided in the housingand adapted to heat a wafer W used as a substrate, with one side of the heating chamberopening for carrying in and carrying out the wafer; and a heating platesprovided in the heating chambersuch that the wafer W can be heated from both above and below. A cooling plateis provided in the housinglocated in the vicinity of the opening of the heating chamber, for cooling the wafer W after being heated by the heating plates. Additionally, a carrying means is provided in the housingfor carrying the wafer W between an upper position of the cooling plateand the interior of the heating chambersuch that a heat treatment for the wafer W can be performed with the wafer W being held in the heating chamber