The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2010
Filed:
Dec. 11, 2007
Applicants:
Kunihiko Iwamoto, Kyoto, JP;
Toshihide Nabatame, Tokyo, JP;
Koji Tominaga, Kyoto, JP;
Tetsuji Yasuda, Ibaraki, JP;
Inventors:
Kunihiko Iwamoto, Kyoto, JP;
Toshihide Nabatame, Tokyo, JP;
Koji Tominaga, Kyoto, JP;
Tetsuji Yasuda, Ibaraki, JP;
Assignee:
Rohm Co., Ltd., , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/8242 (2006.01); H01L 21/4763 (2006.01); H01L 21/461 (2006.01); H01L 21/302 (2006.01); H01L 21/469 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a metal compound thin film is disclosed. The method may include forming a first metal compound layer on a substrate by atomic layer deposition, performing annealing on the first metal compound layer in an atmosphere containing a nitrogen compound gas, thereby diffusing nitrogen into the first metal compound layer, and forming a second metal compound layer on the first metal compound layer by atomic layer deposition.