The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7785175 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 31, 2010

Filed:

May. 20, 2005
Applicants:

Toshiro Doi, Fukuoka-shi, Fukuoka, JP;

Takashi Fujita, Mitaka, JP;

Inventors:

Toshiro Doi, Fukuoka-shi, Fukuoka, JP;

Takashi Fujita, Mitaka, JP;

Assignees:

Tokyo Seimitsu Co., Ltd., Tokyo, JP;

Other;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polishing device is hermetically accommodated in a chamber containing an atmosphere having a composition different from the ambient air, so that the atmosphere around the polishing device is altered into the composition different from the ambient air, and voltage is applied between a wafer and a polishing pad to polish the wafer with an electrolytic effect. The polishing device has the atmosphere containing extremely less oxygen, preventing a surface of the wafer from oxidation and thereby providing a constant polishing rate.


Find Patent Forward Citations

Doi, Toshiro. (2010). Method and apparatus for chemical mechanical polishing (U.S. Patent No. 7785175). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7785175

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…