The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2010

Filed:

Jan. 18, 2008
Applicants:

Tsong-hua Ou, Taipei, TW;

Ying-chou Cheng, Taipei County, TW;

Chia-chi Lin, Hsin-Chu, TW;

Ru-gun Liu, Hsin-Chu, TW;

Chih-ming Lai, Hsin-Chu, TW;

Min-hong Wu, Nantou County, TW;

Yih-yuh Doong, Hsin-Chu, TW;

Cliff Hou, Taipei, TW;

Yao-ching Ku, Hsin-Chu, TW;

Inventors:

Tsong-Hua Ou, Taipei, TW;

Ying-Chou Cheng, Taipei County, TW;

Chia-Chi Lin, Hsin-Chu, TW;

Ru-Gun Liu, Hsin-Chu, TW;

Chih-Ming Lai, Hsin-Chu, TW;

Min-Hong Wu, Nantou County, TW;

Yih-Yuh Doong, Hsin-Chu, TW;

Cliff Hou, Taipei, TW;

Yao-Ching Ku, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system, method, and computer readable medium for generating a parameterized and characterized pattern library for use in extracting parasitics from an integrated circuit design is provided. In an embodiment, a layout of an interconnect pattern is provided. A process simulation may be performed on the interconnect pattern. In a further embodiment, the interconnect pattern is dissected into a plurality of segments taking into account OPC rules. A parasitic resistance and/or parasitic capacitance associated with the interconnect pattern may be determined by a physical model and/or field solver.


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