The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2010
Filed:
Dec. 06, 2007
Robert Gideon Wodnicki, Niskayuna, NY (US);
Stacey Joy Kennerly, Albany, NY (US);
Wei-cheng Tian, Clifton Park, NY (US);
Kevin Matthew Durocher, Waterford, NY (US);
David Martin Mills, Niskayuna, NY (US);
Charles Gerard Woychik, Niskayuna, NY (US);
Lowell Scott Smith, Niskayuna, NY (US);
Robert Gideon Wodnicki, Niskayuna, NY (US);
Stacey Joy Kennerly, Albany, NY (US);
Wei-Cheng Tian, Clifton Park, NY (US);
Kevin Matthew Durocher, Waterford, NY (US);
David Martin Mills, Niskayuna, NY (US);
Charles Gerard Woychik, Niskayuna, NY (US);
Lowell Scott Smith, Niskayuna, NY (US);
Other;
Abstract
A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.