The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2010
Filed:
Dec. 21, 2006
Wen-liang Luo, Toufen Town, TW;
Yung-liang Kuo, Hsin-Chu, TW;
Hsu Ming Cheng, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method of forming a semiconductor structure includes providing a stack structure having a first side and a second side opposite the first side. The stack structure includes a bottom wafer comprising a substrate; a plurality of through-silicon vias in the substrate; and a plurality of under bump metallurgies (UBMs) connected to the plurality of through-silicon vias, wherein the UBMs are on the first side of the stack structure. The method further includes attaching a handling wafer on the second side of the stack structure; performing a chip probing process; and removing the handling wafer from the stack structure.