The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7776993 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 17, 2010

Filed:

Jun. 15, 2005
Applicants:

Stephen Leslie Buchwalter, Hopewell Junction, NY (US);

Claudius Feger, Poughkeepsie, NY (US);

Gareth Hougham, Ossining, NY (US);

Nancy Labianca, Yalesville, CT (US);

Hosadurga Shobha, Yorktown Heights, NY (US);

Inventors:

Stephen Leslie Buchwalter, Hopewell Junction, NY (US);

Claudius Feger, Poughkeepsie, NY (US);

Gareth Hougham, Ossining, NY (US);

Nancy LaBianca, Yalesville, CT (US);

Hosadurga Shobha, Yorktown Heights, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C07D 303/32 (2006.01); C08G 2/30 (2006.01); C08K 3/36 (2006.01); C08L 59/00 (2006.01); C08L 61/02 (2006.01); C08L 63/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
Abstract

A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled microelectronic package. A method for using the reworkable thermoset material in the formation of a microelectronic package using this material.


Find Patent Forward Citations

Loading…